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Autodesk’s Moldflow 2024 and Moldflow 2025 versions introduce several significant updates, improving both usability and computational efficiency for plastic injection molding simulation.

Here are three new features of Moldflow 2024:

1. Material Data Management
The material database has been separated from the main software, allowing for easier and more frequent updates without requiring a full software upgrade. This provides users with updated material test data for more accurate simulations.

2. User Interface and Solver Enhancements
Warp prediction in the Dual Domain method has been improved for greater accuracy, especially in edge elements. 3D simulations now better capture negative sink mark predictions and warpage scenarios. The molding process window analysis includes updated values according to industry standards, enhancing the default processing parameters.

3. STAMP Model in Insight
The new Shrinkage Test Adjusted Mechanical Properties (STAMP) model improves the prediction of warpage and residual stresses in thermoplastics by using measured material shrinkage data.

Additional new features of Moldflow 2025:

1. Faster 3D Analysis
A major focus has been placed on reducing solution times through improved multithreading and code efficiency. These improvements are particularly impactful in advanced molding types such as core shift, gas-assisted injection, and compression molding.

2. Material Database Updates
Version 2025 adds environmental filters (e.g., biodegradable, recycled materials) to the material database, making it easier to select eco-friendly materials. More than 13,300 thermoplastic materials are now supported.

3. Improved Flow and Warpage Accuracy
Enhancements in the Dual Domain and 3D flow models provide more accurate predictions of temperature and flow velocity, reducing discrepancies in temperature drops during simulations.

These updates make Moldflow 2024 and 2025 more accurate, user-friendly, and faster,

helping engineers improve injection molding simulations for various manufacturing applications.

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